
High-density surface-mount electronics
Multi-layer mainboards and flex PCBs are printed on automated SMT lines with SPI solder inspection, AOI after reflow and 100% ICT/fixture verification. Bluetooth SoCs, MEMS microphones, camera modules, battery protection and touch controllers are placed in-house — never brokered to an unnamed board house.
- Equipment
- Multi-zone reflow, AOI, SPI, ICT fixtures
- Components
- BLE SoC, MEMS mic, camera MCU, PMU, sensors
- Traceability
- Reel lot codes recorded per production batch













