R&D — Electronics (EE)
Mainboard and flex PCB architecture, BLE audio/camera SoCs, power management, sensors and high-speed signal work from EVT through mass production.
Smart glasses are a hardware problem before they are anything else: electronics that fit behind a hinge, optics measured to a degree, firmware that ships and keeps shipping. If you want to solve those problems on products that reach real customers in forty-plus markets, this is where you do it.


CYNRIN is the smart-glasses manufacturing brand of Shenzhen Kingring Technology Co., Ltd. Unlike trading companies that resell whatever the nearest line produces, we engineer the reference platforms — V03-T5, E13, K01 — and then manufacture them for brands worldwide. R&D sits minutes from the SMT floor, so a firmware fix can be validated on hardware the same afternoon.
We hire people who want the full loop: spec, prototype, pilot, mass production, field feedback, next generation. Roles are based at our Shenzhen facility; English is the working language for customer-facing work.
Engineering depth meets production discipline. Every department is staffed around the same goal: repeatable, shippable smart glasses for demanding overseas customers.
Mainboard and flex PCB architecture, BLE audio/camera SoCs, power management, sensors and high-speed signal work from EVT through mass production.
Embedded firmware, OTA channels, voice and camera features, and the companion-app integration branded customers rely on after launch.
Lens geometry, transmittance and UV400 validation on optical benches, plus speaker and microphone tuning on acoustic fixtures.
Frame architecture, materials (TR90, nylon, metal), color and finish, CMF direction and DFM collaboration with the tooling shop.
SMT and assembly process engineering, AOI/ICT fixtures, aging, AQL inspection and reliability engineering.
Component sourcing, reel-level traceability, vendor management, capacity planning and export logistics.
English-language ownership of OEM/ODM accounts, RFQ coordination, trade-show programs and reorder relationships.
Retail packaging structure, dielines, unboxing direction and localized collateral for global retail and FBA channels.
Base salary, project performance incentives and social insurance in line with Shenzhen manufacturing-industry standards.
Shielded RF room, optical benches, acoustic fixtures, 3D printing and SMT lines on site — not rented for visitor tours.
Certification and training support for quality, engineering and compliance methods such as Six Sigma, ISO 9001 auditing and lab techniques.
Direct work with brands across the EU, North America, the Middle East and APAC, plus support for IFA, GITEX and Hong Kong Electronics Fair travel.
ESD-controlled workcells, annual health check support and structured safety training across factory and lab environments.
Project-based schedules with defined EVT/DVT/PVT gates instead of perpetual crunch; overtime is the exception, not the operating model.
You will not be parked on one station. Engineers and commercial hires rotate through the phases that matter, with senior review at every gate.
Product platform training across V03-T5/E13/K01, ESD and safety certification, and a named mentor from your department.
Shadow EVT, DVT and PVT reviews and learn the inspection and documentation standards behind ISO 9001 production.
Own a module, process or account end to end, with your work visible in samples and mass-production builds.
Technical specialist or project-lead paths, including customer-facing and trade-show responsibilities for qualified engineers.

EE, firmware, ID, quality and sales review programs together — decisions reach the line the same day.

R&D, sales and production planning share one site in the world’s electronics supply-chain hub.

RF, optical and acoustic validation runs continuously as new platforms and customer programs progress.

Team members join IFA, GITEX and Hong Kong Electronics Fair programs and hear customer feedback first hand.
All positions are based at our Shenzhen facility. There is no HR inbox yet — applications route through our main company mailbox and are forwarded directly to the hiring manager. Include the role title in the subject line.
Don’t see your role? Speculative applications from EE, firmware, optics and quality engineers are welcome at [email protected].
Send an English CV to [email protected] with the role title in the subject. Hiring managers review within five working days.
One video or on-site interview with your future team lead: real engineering or account problems, not brain teasers.
A short, role-relevant task — a firmware bug analysis, optical tolerance question, process case or customer email reply.
A conversation with department management, followed by a written offer with role scope, package and start date.
Interview logistics, relocation questions and accommodations: mention them in your email and we will respond directly.
Company background, engineering culture and Shenzhen facility.
Explore02The platforms, labs and test methods your future colleagues build on.
Explore03SMT, assembly, aging and packing operations in detail.
Explore04Company announcements, trade-show presence and milestones.
ExploreSend your CV and the role you want to [email protected]. A hiring manager reads every application.